1. Prototypes are to IPC1.
2. No design checks for this service.
3. PCB’s will be delivered in either panels with breakout tabs or single circuits, depending on factory recommendations.
4. PCB files must be supplied with a 2.5 mm spacing allowance subject to circuit design/size and manufacturing process considerations.
5. IMP do not offer panelisation service for prototypes. If files are not supplied panelised, then it will be up to the discretion of the manufacturer to provide a panelisation solution that works with their production operations.
6. Gerber in binary formats are accepted. (Gerber files will require drill information if not embedded in file).
7. To minimise cost for this service, IMP do not produce extra panels and as such the Yield may be less than 100% at times.
8. Where the minimum quantity required is critical, this Prototype service will not be suitable and our standard service will be offered.
9. 1 & 2 Layer standard build:
a) FR4 laminate, 1.6mm thickness, copper 35 microns (1 oz),
b) Green solder mask, ENIG, minimum 0.15 mm (0.006”) track & spacing, Routing only, white overlay,
c) Electrical test included.
10. Multilayer standard builds are confirmed on order. Typical build is FR4 laminate, 1.6 thickness
a) External layers copper foil plated to 35 microns (1 oz), prepregs,
b) Internal layers FR4 core, 18 - 35 micron (1 oz) each side,
c) Green solder mask, ENIG, minimum 0.15 mm (0.006”) track & spacing, Routing only, two white overlay,
d) Electrical test included.
11. Despatch dates are confirmed at the time of order and may vary subject to EQ’s (engineering questions from IMP’s manufacturer for this service). Production starts once this process is finalised.
12. Nominated in-store delivery times are based on capital city metropolitan areas only.
13. Exchange rate variances may impact pricing.
14. This offer is subject to change without notice and should be confirmed prior to or on acceptance of order.
IMP standard terms and conditions apply.
